Solder Paste 30gm | Tin Soldering Flux for SMD Rework, IC Reballing & PCB Repair – 220°C Melting Point
Solder Paste for SMD Rework
IC Reballing Solder Paste
Tin Soldering Flux 30gm
Low Oxidation Solder Paste
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Product Description
Brand | Generic |
|---|---|
Product | Solder Paste |
Solder Paste/PPD Paste for SMD Rework Station – 30gm Tin Soldering Flux for IC Reballing
This high-quality solder paste is designed for SMD rework stations and is ideal for mobile IC reballing, PCB repair, and micro-soldering tasks. With a melting point of 220°C, it ensures strong bonding, low oxidation, and smooth soldering. Suitable for all mobile IC reballing kits, this solder paste is widely used in electronics repair, mobile servicing, and circuit board assembly.
Key Features:
High-Quality Solder Paste – Ensures reliable and long-lasting soldering connections.
Perfect for SMD Rework – Specially formulated for SMD components, BGA reballing, and IC repairs.
Melting Point 220°C – Provides strong adhesion and prevents cold solder joints.
Low Oxidation – Reduces oxidation and ensures smooth flow during soldering.
Non-Corrosive Formula – Safe for delicate circuit boards and sensitive electronic components.
Easy Application – Works well with hot air rework stations, stencils, and precision soldering tools.
Applications:
Mobile IC Reballing – Ideal for reattaching mobile phone IC chips.
PCB Repair & Assembly – Used in circuit board soldering and microelectronics repair.
SMD & BGA Components – Perfect for surface mount devices and ball grid array soldering.
Laptop & Gaming Console Repairs – Suitable for motherboard rework, chipset soldering, and more.
Telecommunication & Industrial Electronics – Essential for professional repair workshops.