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MJ-190A Reballing Solder Paste - 190°C, 35g for Precision Repairs

MJ-190A Reballing Solder Paste - 190°C, 35g for Precision Repairs

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  • Optimal Melting Point: Designed to melt at 190°C, ensuring precise and effective soldering for BGA reballing.
  • Perfect for BGA Repairs: Specifically formulated for Ball Grid Array (BGA) applications, providing reliable connections.
  • User-Friendly Application: Easy to use for both professionals and DIY enthusiasts, with excellent flow characteristics.
  • Compact 35g Tube: Convenient size for multiple repairs without taking up too much space in your toolkit.
    • Rs.299.00 Rs.450.00

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    The MJ-190A formula is designed for ease of use, making it suitable for both experienced technicians and DIY enthusiasts. Its user-friendly application allows for seamless soldering, delivering exceptional flow and adhesion properties that enhance your repair work.

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