MJ-190A Reballing Solder Paste - 190°C, 35g for Precision Repairs
Low temperature solder paste
BGA reballing solder paste
PCB and SMD soldering
High-purity solder paste
Microelectronics repair paste
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Product Description
Brand | Generic |
|---|---|
Model | MJ-190A |
Product | Reballing Solder Paste |
MJ-190A Reballing Solder Paste
MJ-190A Reballing Solder Paste is specially formulated for BGA reballing, chip repair, and precision soldering applications. With a melting point of 190°C, this high-quality solder paste ensures reliable connections and smooth soldering for microelectronics, PCBs, and mobile repairs. It offers excellent adhesion, oxidation resistance, and minimal residue, making it ideal for professional and DIY repairs.
Key Features:
Low-Temperature Soldering – Melting point of 190°C, perfect for delicate electronic components.
High Purity Formula – Ensures strong adhesion and low oxidation, reducing defects in soldering.
Fine Particle Size – Provides smooth application and precise bonding for BGA, SMD, and PCB repairs.
Minimal Residue & Easy Cleanup – Leaves little to no residue, reducing post-soldering cleaning effort.
35g Volume – Sufficient for multiple repairs, making it cost-effective for professionals and hobbyists.
Wide Compatibility – Works with lead-free and leaded soldering, suitable for various repair needs.
Applications:
BGA Reballing & Chip Repair – Ideal for CPU, GPU, and IC chip reballing in laptops, smartphones, and gaming consoles.
PCB & SMD Soldering – Used in microelectronics assembly for circuit boards and fine-pitch components.
Mobile & Laptop Repairs – Essential for fixing damaged solder joints in smartphones, tablets, and computers.
Industrial & DIY Electronics – Suitable for both professional technicians and electronics hobbyists.